in by IEEE Std in order to ensure interoperability and common good practices. Thanks to this standard, conduction cooled boards and chassis. Find the most up-to-date version of IEEE at Engineering (This foreword is not a part of IEEE Std , IEEE Standard for Mechanical Core Specifications for Conduction-Cooled Eurocards.) This document.
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Electronic thermal management utilizing device with deflectable, two-leg conductive member; and with elastic, thermally-conductive material there between. The embodiments of an invention in which an exclusive property or right is claimed are defined as follows: The increased wedgelock size approximately doubles the clamping force applied. Citations are based on reference standards. Create lists, bibliographies and reviews: The particular values and configurations discussed above can be varied and are cited merely to illustrate a particular embodiment of the present invention and are not intended to limit the scope of the invention.
The adapter frame of the present invention comprises an extended width ieee 13an extended width shim 15and an extension 16 to the existing frame 1 so that the circuit card module contacts the cold wall of the conduction-cooled chassis 2. This requires an approximately 0. A full appreciation of the various aspects of the invention can only be gained by taking the entire specification, claims, drawings, and abstract as a whole.
Thermal conductance retainer for electronic printed circuit boards and 111.2 like. In a convection-cooled chassis as shown in FIG. The other thermal path for component 6 shown by the dotted arrow in FIG.
Application layer service definition – Type 11 elements IEC Utilizing a convection cooled electronic circuit card for producing a conduction cooled electronic card module. COTS circuit card modules generally have at least one printed wiring board PWBat least one component mounted on the PWB, a heatsink or some type of heat path, a frame for supporting the cards, and a wedgelock for use with a conduction-cooled chassis. In any event, an extended width wedgelock allows for greater surface contact area 30 to improve the thermal performance.
It is contemplated, however, that certain convection-cooled iewe would require the use of an extended width wedgelock and thus, it is shown for purposes of illustration.
Conduction-Cooled PMC (CCPMC)
Iwee to the embodiment of FIG. This, in turn, reduces the module to chassis interface temperature rise. DE DET2 en The increased force, in combination with the additional contacting surface areas, significantly reduces the thermal resistance between the frame and the chassis 2 cold wall. However, in the event that the circuit card module is to be used in commercial non-military applications and convection cooled, then the wedgelock 3 would not be present.
Conduction cooled CompactPCI boards ready for insertion | GE Automation
In most cases the mating surface is the wall of the systems enclosure. The present invention is depicted in FIG.
Ueee addition, the adapter allows for the use of an extended width wedgelock to increase the clamping force over the conduction contact area. The restructuring results in a frame 11 that optionally eliminates the protrusion 4 of FIG.
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Please verify that you are not a robot. Once adapted, however, the COTS module is not backwards compatible with the convection-cooled type racks.
Caution the offer 1 user is reserved for a single user, any broadcast even within his ueee is prohibited. In the conduction-cooled configuration, the component heat is removed by conduction to the chassis cold wall.
Remember me on this computer. Code s Theme s The heat is then removed from the chassis by external means.